Photonics for Quantum

The Photonics for Quantum (P4Q) Pilot Line will establish a distributed, pan-European infrastructure for manufacturing highperformance photonic integrated circuits (PICs) tailored to quantum applications. Quantum technologies, including computing, communication, and sensing, rely heavily on photonics for encoding, processing, and detecting quantum information.  

P4Q will address the stringent requirements of these technologies, such as low-loss operation, cryogenic compliance, and high precision, by stabilizing cutting-edge manufacturing processes and advancing both technology readiness levels (TRLs) and manufacturing readiness levels (MRLs) to level 8.  

The initiative builds on Europe’s stronghold in photonic manufacturing and leverages expertise from leading foundries, startups, and research institutions. It will unite and enhance existing manufacturing capabilities by building application-agnostic technology from application-specific use cases. Key deliverables include the development of process and assembly development kits (PDKs and ADKs), robust manufacturing lines, and a governance structure to ensure open-access availability and IP retention within Europe. 

Through collaboration with lead users—innovative EU-based start-ups—the pilot line will validate quantum-specific PICs while fostering feedback-driven improvements. The phased approach will culminate in industrial manufacturing capabilities, providing a pathway to commercialization and securing Europe’s position as a global leader in quantum photonics. P4Q will establish European leadership in quantum technologies by collaboratively addressing critical gaps, fostering innovation, and stabilizing manufacturing. 

Role of AMIRES 

AMIRES is responsible for dissemination, communication, clustering and skill development activities 

Project partners list 

P4Q, the Framework Partnership Agreement of the Chips Joint Undertaking for Photonics for Quantum, is supported by Horizon Europe and the National Public Authorities of the partners involved, under grant agreement No 101233082.